[Insurance Pain-points] It is a great honor that our CEO – William Yeung is invited by The Hong Kong Institute of Bankers to do sharing in “Hong Kong ICT Awards 2021: Sharing Session of FinTech Award Winners”. As a gold medal winner in (Banking, Insurance and Capital Markets), William disassembles how to use new technologies to solve problems in the insurance industry, such as automation of insurance claims, how to apply blockchain technology to make claims safer and more efficient, and transform the future local market. We hope that the sharing can be inspiring, and together we can promote the insurance industry to take a new step.
Sharing at The Hong Kong Institute of Bankers
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